The major educational developments over the life of the Center are presented
below.
| Important Educational Developments at the Low-Cost
Electronic Packaging Research Center |
| Item |
Impact |
Significance |
Year |
| Curriculum Development |
Focused programs of study for undergraduate students
and packaging certificate program for master level graduate students. |
Provide a pool of graduates with depth in key and fundamental
engineering areas relevant to packaging for the industry to choose
from. |
1998 |
| Practice Oriented Master's Program Development |
Graduate students who plan to go immediately into industry
rather than seek a PhD. |
This program will provide depth in key fundamental
scientific and engineering areas relevant to packaging, as well as
providing breadth by exposing students to management concepts and
foreign culture (through internship experiences). |
1998 |
| DBO Course Development |
Senior level design, build and operate courses. |
The two courses will focus on substrate fabrication
and module assembly. Each course will focus heavily on lab exercises
which will permit students to design, build, assemble and test electronic
packages. |
97-98 |
| National and International Education Programs with
IEEE |
Three existing (plus six in the future) packaging educational
projects for undergraduate and graduate students have been initiated
at academic institutions that address the needs of the packaging industry
in the 21st century. |
Cooperation with other universities (Minnesota, Maryland,
Auburn and Illinois so far) broadens the educational resources and
expertise, and increases the number of packaging students. |
96-98 |
| Short Courses |
First comprehensive next generation packaging short
courses (15-20 annually) for industry engineers. |
Rapid rate of technology advances in electronic packaging
makes continuing education essential. PRC seeks to support such lifelong
learning through a variety of short courses, workshops & conferences. |
96-98 |
| GT-SUPREEM |
45 minority undergraduate students from 17 institutions
have participated in an eight-week summer research experience over
the last three years. 90 percent of the participants went to graduate
school thereby increasing the number of students seeking advanced
degrees in packaging. |
Higher educated, diverse workforce to address the research
and development of next generation packaging technologies to achieve
global competitiveness. |
94-98 |
| GIE |
Engineering, management, and global education experience
for over 20 students |
Development of globally competitive engineers is essential
to U.S. competitiveness in the global electronics market |
95-98 |
| Workshops & Conferences |
PRC organizes workshops and conferences at national
and international level in a number of strategic research areas. These
are attended by industry engineers and scientists as well as university
faculty and students. |
Provides means of dissemination of recent findings
in the electronic packaging area to industry and academia. |
95-98 |
| System-level and cross-discipline undergraduate and
graduate courses |
Six system-level and 30 cross-discipline courses have
been created that incorporate the most recent research findings. |
An advanced course work next to research experience
is electronic packaging is necessary to fulfill the needs of the present
workforce. |
94-98 |
| Undergraduate and graduate research experience |
Hands-on education opportunities for the PRC students
at the state-of-art research facilities |
Provides industrial culture on the academic campus.
Makes the transition from academia to industry smoother after graduation. |
94-98 |
| Text book |
Microelectronics Packaging Handbook |
It currently serves as the primary reference book in
electronics packaging. |
96-97 |
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